This is an idea that entered my mind. The traditional way is applying some etch resist like toner or dry film, etching away the copper and then adding solder mask before populating the board with components.
Can the solder mask be used as etch resist instead? It feels like skipping an unnecessary step in the process. Why isn´t this more common? This way you won´t need the step of removing etch resist only to replace it with a slightly different compound.
You’d still need to apply a second layer after the etching. There’s less risk of misalignment if the solder mask is all applied at once, so might as well use the more appropriate resist.
Why is that? I understand there is a tiny layer of exposed copper on the side of the traces but copper tends to form a protective layer of oxide.